APRIL 2019
 
 

ACTIVE PRODUCTS AND SOLUTIONS


We are happy to offer you an update on the latest products and technology innovations to enhance your designs. For more information about any of the new products or our general support and services please contact us.

Best regards,
The Avnet Israel Team 		 
 
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PRODUCT HIGHLIGHTS
    
 
 
 
Xilinx

Xilinx® U250 Alveo™ Card A: Xilinx® U250 Alveo™ Data Center Accelerator Card Active Cooling  

Virtex UltraScale+ HBM FPGA®: High Performance FPGA with on-board High Bandwidth Memory
 
Maxim

MAX17261: 5.1µA Multi-Cell Fuel Gauge with ModelGauge m5 EZ

MAX20310: Ultra-Low Quiescent Current PMIC with SIMO Buck-Boost for Wearable Applications
 
STMicroelectronics

STM32WB series:  Multi-protocol, ultra-low-power MCU system-on-chip with BLE 5.0 & IEEE 802.15.4
STM32F730: STM32F7 value line with 64KB Flash and 192KB RAM
STM32MP1: witth dual Arm® Cortex®-A7, a Cortex®-M4 and a 3D GPU.
LSM6DSO: iNEMO inertial measurement unit (IMU): 3D accelerometer and 3D gyroscope
 
Nordic

MPM3506A: Synchronous, rectified, step-down converter with built-in power MOSFETs, inductor, and two capacitors
 
Nordic

nRF52811: Multiprotocol Bluetooth® 5.1 direction finding system-on-chip with powerful 64 MHz Arm® Cortex-M4™ CPU
 
Rohm

SCT3xxxxxHR series: Family of AEC-Q101 qualified SiC MOSFETs with high reliability
 
Vishay

VEMD8080: Vishay High Speed PIN Photodiode for Wearables

TFBR4650: New TFBR4650 IrDA®-Compliant IR Transceiver®
 
 
Broadcom

BCM53112:Low-power Fast-Ethernet RoboSwitch™-2 with High-Speed 1GbE/2.5GbE Uplink Interfaces
AFBR-S4N44C013: NUV-HD Single Silicon Photo Multiplier
 
Renesas
Winning Combinations from IDT and Renesas: A full product portfolio working together to deliver comprehensive solutions for industrial applications.
 
ON Semiconductor
Wide Gap Technology: Using materials such as Silicon Carbide, Wide Gap Technology will to bring enhanced reliability to important high-growth end application areas.
NTHL080N120SC1: N‐Channel Silicon Carbide MOSFET 1200 V, 80 mΩ, TO247-3L

AXM0F243: Ultra-Low Power Sub GHz ARM® Cortex®-M0+ Wireless Microcontroller

 
Nexperia

High-power in LFPAK56: High-power Transistors: PHPT6xx series in LFPAK56 - full power in half the footprint

PESDxIVN: In-vehicle networking ESD protection with the latest generation of automotive qualified protection technology
 
NXP

i.MX RT1050-EVKB: i.MX RT1050 Evaluation Kit

QN9080SIP: Ultra-small module based on the QN9080 Bluetooth MCU and NT3H2211 NTAG®

NPS30xx: The last NXP family of digital differential pressure sensor in a tiny 4x5mm LGA package with ceramic lead frame. 

LPC5500: World’s first Arm® Cortex® -M33 based microcontroller series for mass market, leveraging 40nm Embedded Flash technology with TrustZone

 
Toshiba

TC78H653FTG: H-bridge driver IC supporting low-voltage, large current drive

TB67B054FTG: Three-phase brushless fan motor controller IC

XG5-P Series: Client NVMe™ SSD

XG6 Series: Client NVMe™ SSD
 
Western Digital

IX QD 334: High endurance microSD (8GB – 64GB)
 
     
 
     
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